CQFP64GPackages for High Power Lasers

Used to encapsulate high power semiconductor lasers, they are widely used in optical communication, data storage, environmental detection, LIDAR, weather monitoring, flat panel display, lighting, laser processing and medical treatment.

The enclosure consists of high thermal conductivity metal chassis, metal wall, fiber optic tubes, metal leads, and ceramic insulators or glass insulators, and can encapsulate single-chip and multi-chip, which has the advantages of compact size and structure, high efficiency of optoelectronic conversion, stable performance, high reliability, long service life, and easy installation.

A high power device enclosure is an important component used to protect and dissipate heat from high power electronic devices. It is designed and manufactured to provide effective thermal management and physical protection to ensure proper operation and long life of the device.

Finally, high-power device housings usually have good sealing performance to prevent dust, moisture and other harmful substances from entering the device interior. This helps to maintain the clean and stable performance of the device and extends its service life.